Functions: Fast 2D or assisted 3D dimensional measurement, with maximum accuracy of ±3μm.
Applications: 3C electronics, PCB, display panels, precision manufacturing, new energy, metal parts, automotive manufacturing, photovoltaic, semiconductors, LED, plastic products, research institutes, and all scenarios requiring micron-level dimensional measurement.

Functions: High-precision 2D and 3D dimensional measurement, with maximum accuracy of ±1.7μm.
Applications: 3C electronics, PCB, display panels, precision manufacturing, new energy, metal parts, automotive manufacturing, photovoltaic, semiconductors, LED, plastic products, research institutes, and all scenarios requiring micron-level dimensional measurement.

Functions: Enables super depth-of-field 3D imaging of samples to observe and analyze surface structures, with a maximum magnification of up to 5000x.
Applications: New energy batteries, ceramics, metals, semiconductors, chips, and other materials science and production testing; semiconductor manufacturing and packaging inspection; 3C electronic glass screens and precision components; optical processing, micro-nano material manufacturing, automotive parts, MEMS devices, as well as ultra-precision machining industries, aerospace, and research institutes.